Direct Copper Bonded

Direct Copper Bonded
Struktur eines Direct Bonded Copper Substrates (oben) und eines isolierten Metal Substrates (unten).

Direct Bonded Copper, (DBC, Direct Copper Bonded, DCB), ist eine spezielle Halbleiter-Struktur, die eine enge elektrisch/thermische Verbindung über Kupfer ermöglicht. Dies ist für eine optimale Wärmeableitung wichtig.

Das DBC-Substrat ist technisch günstig herstellbar. Auf dem DBC-Substrat können leicht großflächige, metallische Leiterbahnen-Strukturen erstellt werden.

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